SAMSUNG TECHWIN

SAMSUNG TECHWIN, OUR COMPANY

  • OUR COMPANY
    • CEO
    • Information
    • Vision
    • History
    • CI
  • OurBusiness
  • Corporate Citizenship
    • Introduction
    • Representative Contribution
    • Major Program
  • Green Management
  • Compliance Program
  • Moral Management
  • Global Networks
    • Head Office
    • Overseas

History

  • 2000
  • 1990
  • 1980
  • 1970

HISTORY 2000's

  • 2010

    • Consolidated the electronic security business.
  • 2009

    • spun off of digital camera business.
    • Established SSMT in Shanghai, China and TSTO in Tianjin, China.
    • Signed a strategic partnership agreement with Dresser-Rand in the USA for gas compressors and power generators.
    • Held a signing ceremony for the smart project robot business agreement.
    • Won two gold medals in the World Skills Competition in 2 divisions (Mold making, CNC lathe)
    • Green Management Announcement Ceremony.
  • 2008

    • Established Bio-Technology Research Center in Maryland and Houston Turbo Design & Development Research Center in the USA.
    • Hosted ground-breaking ceremony for the Pangyo R&D Center.
    • Established industry-academy collaboration research centers with leading universities
    • in Korea(Seoul National, Yonsei, Sungkyunkwan, and Hanyang Universities).
    • Developed the World's First super thin 8 Mega pixels Optical 3X zoom camera
    • module 'ABACUS'.
  • 2007

    • Completed the new TSOE factory in Tianjin, China.
    • Celebrated our 30th anniversary.
    • VLUU i7 and Smart Touch won the UI TIPA Awards 2007.
    • Completed an agreement with the Ministry of Commerce, Industry and Energy (MOCIE) for the development of social security robots.
    • The development of a gas turbine-operated combined heat power generation system, the first of its kind in Korea, at the Samsung Medical Center, Seoul.
    • VLUU i70 won the EISA Awards.
    • Introduced new premium digital cameras (including the NV20/NV15/NV8/i85) onto the market.
    • Established a system for monitoring the production and quality of semiconductor parts.
    • DSC Department relocated to Suwon.
  • 2006

    • Introduced the Exchangeable Lens D-SLR Camera GX-1S onto the market.
    • Introduced the slim-type #11PMP with PMP features, the first of its kind in the world, and standard digital cameras onto the market.
    • Changwon 1st Plant won the “Eco” mark.
    • Semiconductor System Department relocated from Changwon 1st Plant to Changwon 2nd Plant.
    • Semiconductor System Department opened the Chip Mounter Technology Center in Shanghai.
    • Digital camera NV Series introduced onto the market.
    • Developed modules for 3x optical zoom, 5-million-pixel and 3-million-pixel miniature camera phones.
    • The DSLR Camera GX-10 was introduced onto the market.
    • Hosted the ceremony for the introduction of the K10, the world’s first robot-type armored ammunition carrier.
    • Held the TOP Room opening ceremony at the Namun Office.
  • 2005

    • Introduced the SM 320, a high-speed, high-precision chip mounter, onto the market.
    • Introduced a slim-type digital camera #1 onto the market.
    • Introduced the KENOX Pro-815, an 8-million-pixel digital camera, onto the market.
    • Completed the BOC production line at Changwon 1st Plant.
    • Developed the K10, a robot-type armored ammunition carrier.
    • Signed a contract for the joint development of the Exchangeable Lens D-SLR camera with Pentax of Japan.
    • Commenced work on the new factory in Tianjin, China.
  • 2004

    • Won the Chang Yeong-sil Award for a turbo compressor.
    • Sold our 5,000th chip mounter.
    • Introduced a 7-million-pixel digital camera, the KENOX Alpha-7, onto the market.
    • Changwon 2nd Plant produced the first engine for the next-generation F-15K fighter plane.
  • 2003

    • Introduced the Kenox V4, a 4-million-pixel digital camera, onto the market.
    • Developed the new CP-55 chip mounter.
    • Completed the work on a production line for camera modules for cellular phones at Changwon 1st Plant.
    • Produced a trial model of the XK-10, an ammunition carrier.
    • Introduced the Kenox U-CA3 camera onto the market.
  • 2002

    • Developed the SWB-800, a new gold wire bonder.
    • Won an export order for 51 million dollars’ worth of cameras.
    • Commenced the second KFP-Ⅱ project at Changwon 2nd Plant.
    • Commenced the production of camera modules for cellular phones.
    • Established the Semiconductor Development Center.
    • Signed a contract for the supply of engines for the FX Project.
    • Semiconductor System Department shipped out the first bio medical equipment.
    • The development of an ammunition carrier for the K9 self-propelled gun (XK10 Project) in conjunction with the Ministry of National Defense.
  • 2001

    • Semiconductor Material Department signed a contract to export micro PPF technology.
    • Semiconductor Material Department signed a contract with Sumitomo of Japan to export the technology for galvanizing ultra-thin film palladium micro PPF (with patent rights).
    • Turkish Land Forces Command (TLFC) signed in contract with the Defense Program Division of Samsung TechWin for three hundred of the 155mm K9 self-propelled howitzers
    • Entered the precision medical equipment market, making an agreement with Corentec for the joint development of artificial joints.
    • Shipped the engine for the Korean-type naval destroyer KDX-Ⅱ.
  • 2000

    • Sold our twenty millionth camera.
    • Relocated the Wire Bonder Division from Sungnam 1st Plant to Changwon 1st Plant.
    • Changed the company’s name to Samsung Techwin Co. Ltd.
    • Semiconductor System Department produced the ten millionth CP-40 chip mounter.
    • Won a $100 million order for engine parts from P&W of the U.S.
    • Developed the Digimax 35MP3, an MP3 reproducible digital/PC camera.
    • Launched the 6-Sigma management system.
    • Completed the first project for amphibious assault vehicles at Changwon 3rd Plant.
    • Introduced the first engine for the KT-1 onto the market (Changwon 2nd Plant).